Company Description
Unisem (M) Berhad. The Group's principal activities are the manufacture and sale of semiconductor devices and other related services. The Group provides full turnkey solutions to its customers in wafer grinding, packaging and testing of ...
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Breaking News
BusinessWeek - November 16, 2009 4:01 AM
KUALA LUMPUR, Malaysia--(BUSINESS WIRE)-- Unisem (M) Berhad (Unisem) announced today that it has placed an order with BE Semiconductor Industries N.V. (Besi) for the delivery of 100 Esec wire bonders, following an order placed earlier this year for 54 ...
Reuters - November 16, 2009 3:08 AM
KUALA LUMPUR, Malaysia--(Business Wire)-- Unisem (M) Berhad (Unisem) announced today that it has placed an order with BE Semiconductor Industries N.V. (Besi) for the delivery of 100 Esec wire bonders, following an order placed earlier this year for 54 ...
Forbes.com - November 16, 2009 3:05 AM
BusinessWire - Unisem (M) Berhad (Unisem) announced today that it has placed an order with BE Semiconductor Industries N.V. (Besi) for the delivery of 100 Esec wire bonders, following an order placed earlier this year for 54 wire bonders. These machines ...
IC Chip Assembly Services
Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging
www.icchippackaging.com
Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging
www.icchippackaging.com
