IC Packages 

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Manufacturers and suppliers of integrated circuit packages.
Package Assembly & Dicing
Semiconductor Assembly, Packaging, Dicing Services. ISO, IC, RF, LED.
www.advotech.com
Resists for Packaging
Advanced Packaging Resists for TSV, Bumping, Flip-Chips & 3D Stacking
www.futurrex.com
Semiconductor Packages
Design and manufacture of low cost wire bondable packages
www.micro-devices.co.uk
Ic Packaging
The Premier, US-based IC assembly & Test Sub-Contractor.
Corwil.com
IC Chip Assembly Services
Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging
www.icchippackaging.com
Wafer Dicing, IC Assembly
Dicing, Open Cavity IC Packaging BGA Reballing, Plastic, Ceramic
www.majelac.com
Semiconductor Packaging
Magazine for Wafer Level & Device Packging/High Density Interconnec
www.waferpackaging.com
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A-Z IC Packages Provider Directory
0-9 | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z
0-9
1TALON LLC
Manufacturer of Bi Polar, JI, DI and CMOS semiconductors and semiconductor packaging.
www.1talon.com
A
Austin American Technology Corp.
Manufacturer of ball grid array rework systems; automatic batch cleaning systems which are used for PCBs, screens and stencils; and surface mount repair/rework systems. Products are sold to the electronics and graphics industries. This company...
www.aat-corp.com
Adapter Technologies
Interconnect solutions provider to original equipment manufacturers, including ball grid array (BGA) applications.
www.adapter-tech.com
Emulation Solutions
Manufacturer of BGA adapters, QFP adapters and test leads. Provider of custom manufacturing. Products and services are sold to the embedded systems industry. This company was capitalized by private investment.
www.adapters.com
Advanced Interconnect Technology
Provider of consultancy services for flip chip on glass (FCOG), flip chip on board (FCOB) and flip chip on flex (FCOF) packaging technologies.
www.ait.com.hk
AIT (Advanced Interconnect Technolgies)
Provider of packaging portfolio and valuable services. Designs ball grid array (BGA) and leaded packages.
www.aitsales.com
Allegro MicroSystems
Manufacturer of advanced mixed-signal integrated circuits, including hall-effect sensors, motor driver ICs, and power interface and management ICs.
www.allegromicro.com
Amkor Technology
Manufacturer of chip-scale packages (CSPs) needed to address high-density requirements.
www.amkor.com
APE Corp.
Manufacturer of printed circuit board rework machines for SMT and BGA components and gold plating and multilayer desolder systems.
www.apecorp.com
Advanced Packaging Technology of America
Manufacturer of hybrid circuit boards, ceramic multi-chip modules, thick-film substrates and cerlids. The cerlids are alumina ceramics used to seal semiconductor packages. Also a provider of surface mount design, testing and assembly services....
www.aptagroup.com
Aries Electronics
Manufacturer of IC sockets, printed circuit cards, packaging products, intelligent connectors, BGA (ball grid array) and LGA (land grid array) sockets, adapters and a variety of jumper and cable assemblies.
www.arieselec.com
ASAT Holdings Limited
www.asat.com
ASM Pacific Technology
Manufacturer of integrated circuit (IC) lead-frame applications equipment and material, chip on board (COB) and discrete device application equipment.
www.asmpacific.com
C
Cascade Microtech Inc
Cascade Microtech offers affordable and complete horizontal and vertical board test systems, enabling precision electrical measurements of IC packages and circuit boards.
www.cascademicrotech.com
ChipPAC, Inc.
Manufacturer of special cases used to attach semiconductors to printed circuit boards. Company also provides IC assembly and test services. Products and services are sold to the semiconductor industry. This company was capitalized by private ...
www.chippac.com
Chip Supply
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
www.chipsupply.com
CORWIL Technology Corporation
Provides high quality and responsive IC assembly and test services to the semiconductor, OEM electronics, military and aerospace and medical industries.
www.corwil.com
D
DSP Architectures
Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
www.dsparchitectures.com
Dynacraft
Manufacturer of lead frames. Also designs, manufactures and supplies microelectronic packaging systems.
www.dynacraft.com
E
E-Mark
Supplier of interconnects and switches, including barrier strips, connectors and headers, data mates, dip switches, sockets and more.
www.e-markinc.com
Enplas-Tesco
Manufacturer of IC test and burn-in sockets, ball grid arrays (BGA) and more.
www.enplas.com
F
F & K Delvotec
Manufacturer of die and wire bonders for discrete devices, integrated circuits (ICs), hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
www.fkdelvotecusa.com
Flip Chip Technologies LLC
Provider of wafer bumping services, reliability modeling, test vehicles, lead-free solder alloys, fluxes and assembly process implementation. Products and services are sold to the semiconductor industry.
www.flipchip.com
G
Gigatest Labs
We perform high bandwidth measurements for verification and modeling of components such as connectors, IC packages, circuit boards, test sockets and passives.
www.gigatest.com
I
IPS
IPS optimized industrial technology is specifically designed to address the needs of high quality interconnect products for the electronic assembly and semiconductor packaging industries.
www.ipsphere.com
Ironwood Electronics
We offer many adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues.
www.ironwoodelectronics.com
K
Kalex
Manufacturer of ball grid array substrates.
www.kalexpcb.com
Kulicke & Soffa (K&S)
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
www.kns.com
Kyocera Corporation
Manufacturer of chip-scale packages for use as mobile phones, DVC, PC cards and various other applications.
www.kyocera.co.jp
M
Micronsult
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
www.micronsult.dk
N
National Semiconductor
Manufacturer of BGA, micro SMD, laminate CSP and leadless lead-frame package (LLP) packages.
www.national.com
NGK Spark Plug Company
Manufacturer of ceramic products which includes packages, multichip modules and more for the semiconductor and related industries.
www.ngkntk.co.jp
P
Palomar Technologies
Manufacturer of hybrid/multichip modules (MCMs) and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders and fully automated assembly lines.
www.palomartechnologies.com
Pantronix
Manufacturer of semiconductors. Produces multichip modules, hybrids, boards, smart cards, and complete builds.
www.pantronix.com
Polymer Flip Chip
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
www.pfccorp.com
Philips
Package information.
www.philipslogic.com
Piper Plastics, Inc
A leading source of parts for every environment in the Semiconductor Industry. We machine and fabricate custom designed parts for ETCH, Lithography, CMP, final test, wafer handling, R&D, along with 1000's of other parts.
www.piperplastics.com
Pure Technologies
Manufacturer of low-alpha and ultralow-alpha lead and lead products ideal for flip chip and C-4 technology in the semiconductor industry.
www.puretechnologies.com
R
RD Automation
Manufacturer of fully automated and manual flip chip bonding systems.
www.rdautomation.com
S
Sac-Tec Labs
Manufacturer of multichip modules (MCM), hybrids and surface-mount modules.
www.sactec.com
Semiconductor Packaging Materials Corporation
Offering a broad array of services that cater to the semiconductor industries, including Tape on Reel and Waffle Pack for pick-and-place automation.
www.sempck.com
Silitronics
Specialist in thick-film hybrid, multichip module-ceramic (MCM-C), microwave and surface mount technology (SMT) circuits.
www.silitronics.com
S.M.T. Assembly
Specialist in surface mount, chip-on-board, through-hole and final casing assemblies for the original equipment manufacturers' market.
www.smt.com.hk
T
Techstar Innovations PTE LTD
Since 1971, MK Gold Bonding Wire has been developed into various types of gold bonding wire for semiconductor packaging, covering TR to Ultra Fine Pad Pitch package.
www.techstar-i.com
Tessera, Inc.
Manufacturer of chip scale packaging and hybrid ICs. Products are sold to multiple industries. This company was capitalized by private investment and venture capital.
www.tessera.com
Rika Denshi America, Inc.
Rika Denshi America is a leading designer and manufacturer of fine-pitch test probes, IC test sockets, and interfaces for the semiconductor packaging and electronics assembly markets.
www.testprobe.com
  • Electro Scientific Industries, Inc.
  • Elma Electronic AG
  • Enplas Corporation
Package Assembly & Dicing
Semiconductor Assembly, Packaging, Dicing Services. ISO, IC, RF, LED.
www.advotech.com
Resists for Packaging
Advanced Packaging Resists for TSV, Bumping, Flip-Chips & 3D Stacking
www.futurrex.com
Semiconductor Packages
Design and manufacture of low cost wire bondable packages
www.micro-devices.co.uk

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Guide to IC Packages

Connect with IC packaging specialists for custom, reliable IC packages

By Apryl Beverly


Simply defined, IC packages are a collection of materials used to protect and interconnect an integrated circuit to the operating system. Today, there is a variety of integrated circuit packages available to customize your integrated circuits. Examples of IC packaging types include tinning, tape and reel packaging, lead forming, baking, lead straightening and programming.

Integrated circuit packages are classified based on the amount of pins in the chip. Today IC chip packaging has become popular, because this method is useful in applications with a low number of pins. Three dimensional (3D) IC packaging is the most recent method used in a broad range of applications: including digital and mixed signal electronics, wireless communication products, sensors and a variety of other devices.

Consider the following tips when choosing integrated circuit package types for your device:

1. Determine which integrated circuit package you need for your electronic device.

2. Find an IC package engineer to help you choose the most reliable IC packaging material.

3. Connect with IC packaging services firms for advice on a full range of IC packaging types.

Action Steps
The best contacts and resources to help you get it done


Evaluate various IC packaging options for your specific electronic device

Dual in-line integrated circuit packaging is the earliest and most commonly used IC package type, because it is manageable. Alternatively, with new technology there are other IC package assembly methods available that are less expensive and even more manageable.

I recommend: DuPont offers 3D IC packaging solutions and allows you to ask questions about a specific IC package type by completing an online form. Maxtek offers semiconductor-packaging services and makes sure you receive uniquely designed IC packages that are manageable and testable.

Seek IC packaging materials advice from an experienced IC package engineer

While silicon and ceramic are standard IC package materials, there are a range of materials that are more durable and flexible. Wafer and substrate bumping pastes and IC chip packaging are a few examples of more durable and flexible IC package types.

I recommend: IC Chip Packaging offers a range of IC packaging services including IC repackaging. With Quik-Pak, customers can provide their own IC packages for processing or the company can consult you on your IC package options and obtain the one that best fits your goals.

Rely on IC packaging services firms as one-stop shops

Getting a new prototype to production can be a difficult process if you are unsure of the proper steps to take. IC package assembly, while an extremely important step, is only one of necessary phases to move your device from conception to production.

I recommend: Aspen Technologies offers the full range of services from new product evaluation to design and IC packaging to production. Wipro offers a full line of advisory, design, IC packaging and manufacturing services to help you turn your idea into an actual product.

Tips & Tactics

Helpful advice for making the most of this Guide

  • •  Making a huge push in Asia and Europe, green integrated circuit packaging is quickly becoming a global initiative in IC packaging. While green IC packaging materials are generally more expensive and less available, you may want to consider environmentally friendly options.
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IC Packages

Connect with IC packaging specialists for custom, reliable IC packages.
Simply defined, IC packages are a collection of materials used to protect and interconnect an integrated circuit to the operating system. Today, there is a variety of integrated circuit packages available to customize your integrated circuits. Examples of IC packaging types include tinning, tape and reel packaging, lead forming, baking, lead straightening and programming. Integrated circuit packages are classified based on the ... Read more

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