MIcroelectronics Assembly
World-class Wire Bond & Flip Chip Class 100 facilities; Design to Mfg
www.aspentechnologies.com
World-class Wire Bond & Flip Chip Class 100 facilities; Design to Mfg
www.aspentechnologies.com
IC Prototype Packaging
Plastic packages, IC Assembly, Wafer preparation, Custom services
www.icproto.com
Plastic packages, IC Assembly, Wafer preparation, Custom services
www.icproto.com
3D Packaging Solutions
Unique dry film photoresist system for TSV formation and protection
wlpsolutions.dupont.com
Unique dry film photoresist system for TSV formation and protection
wlpsolutions.dupont.com
Toshiba ASIC Design
Get Free Design Tips, Case Studies, Quotes, On-line Game & More
www.SocWorld.Toshiba.com
Get Free Design Tips, Case Studies, Quotes, On-line Game & More
www.SocWorld.Toshiba.com
IC Chip Assembly Services
Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging
www.icchippackaging.com
Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging
www.icchippackaging.com
Quick Turn Substrates
Laser vias -- 25um trace/space bga,flip chip,wb - Semi/Med/RF pkgs
www.aclusa.com
Laser vias -- 25um trace/space bga,flip chip,wb - Semi/Med/RF pkgs
www.aclusa.com
Marketing, Info sharing
Professional community, News, Q&As Experience, Products, Jobs
www.moreach.com
Professional community, News, Q&As Experience, Products, Jobs
www.moreach.com
Expedia Vacation Offers
Vacation Smarter in 2008 with Expedia.com - Stay More, Pay Less.
www.Expedia.com
Vacation Smarter in 2008 with Expedia.com - Stay More, Pay Less.
www.Expedia.com
Wafer Dicing, IC Assembly
Dicing, Open Cavity IC Packaging BGA Reballing, Plastic, Ceramic
www.majelac.com
Dicing, Open Cavity IC Packaging BGA Reballing, Plastic, Ceramic
www.majelac.com
A-Z IC Packages Provider Directory
A
Austin American Technology Corp.
Manufacturer of ball grid array rework systems; automatic batch cleaning systems which are used for PCBs, screens and stencils; and surface mount repair/rework systems. Products are sold to the electronics and graphics industries. This company...
www.aat-corp.com
Manufacturer of ball grid array rework systems; automatic batch cleaning systems which are used for PCBs, screens and stencils; and surface mount repair/rework systems. Products are sold to the electronics and graphics industries. This company...
www.aat-corp.com
Adapter Technologies
Interconnect solutions provider to original equipment manufacturers, including ball grid array (BGA) applications.
www.adapter-tech.com
Interconnect solutions provider to original equipment manufacturers, including ball grid array (BGA) applications.
www.adapter-tech.com
Emulation Solutions
Manufacturer of BGA adapters, QFP adapters and test leads. Provider of custom manufacturing. Products and services are sold to the embedded systems industry. This company was capitalized by private investment.
www.adapters.com
Manufacturer of BGA adapters, QFP adapters and test leads. Provider of custom manufacturing. Products and services are sold to the embedded systems industry. This company was capitalized by private investment.
www.adapters.com
Advanced Interconnect Technology
Provider of consultancy services for flip chip on glass (FCOG), flip chip on board (FCOB) and flip chip on flex (FCOF) packaging technologies.
www.ait.com.hk
Provider of consultancy services for flip chip on glass (FCOG), flip chip on board (FCOB) and flip chip on flex (FCOF) packaging technologies.
www.ait.com.hk
AIT (Advanced Interconnect Technolgies)
Provider of packaging portfolio and valuable services. Designs ball grid array (BGA) and leaded packages.
www.aitsales.com
Provider of packaging portfolio and valuable services. Designs ball grid array (BGA) and leaded packages.
www.aitsales.com
Allegro MicroSystems
Manufacturer of advanced mixed-signal integrated circuits, including hall-effect sensors, motor driver ICs, and power interface and management ICs.
www.allegromicro.com
Manufacturer of advanced mixed-signal integrated circuits, including hall-effect sensors, motor driver ICs, and power interface and management ICs.
www.allegromicro.com
Amkor Technology
Manufacturer of chip-scale packages (CSPs) needed to address high-density requirements.
www.amkor.com
Manufacturer of chip-scale packages (CSPs) needed to address high-density requirements.
www.amkor.com
APE Corp.
Manufacturer of printed circuit board rework machines for SMT and BGA components and gold plating and multilayer desolder systems.
www.apecorp.com
Manufacturer of printed circuit board rework machines for SMT and BGA components and gold plating and multilayer desolder systems.
www.apecorp.com
Advanced Packaging Technology of America
Manufacturer of hybrid circuit boards, ceramic multi-chip modules, thick-film substrates and cerlids. The cerlids are alumina ceramics used to seal semiconductor packages. Also a provider of surface mount design, testing and assembly services....
www.aptagroup.com
Manufacturer of hybrid circuit boards, ceramic multi-chip modules, thick-film substrates and cerlids. The cerlids are alumina ceramics used to seal semiconductor packages. Also a provider of surface mount design, testing and assembly services....
www.aptagroup.com
Aries Electronics
Manufacturer of IC sockets, printed circuit cards, packaging products, intelligent connectors, BGA (ball grid array) and LGA (land grid array) sockets, adapters and a variety of jumper and cable assemblies.
www.arieselec.com
Manufacturer of IC sockets, printed circuit cards, packaging products, intelligent connectors, BGA (ball grid array) and LGA (land grid array) sockets, adapters and a variety of jumper and cable assemblies.
www.arieselec.com
ASM Pacific Technology
Manufacturer of integrated circuit (IC) lead-frame applications equipment and material, chip on board (COB) and discrete device application equipment.
www.asmpacific.com
Manufacturer of integrated circuit (IC) lead-frame applications equipment and material, chip on board (COB) and discrete device application equipment.
www.asmpacific.com
C
ChipPAC, Inc.
Manufacturer of special cases used to attach semiconductors to printed circuit boards. Company also provides IC assembly and test services. Products and services are sold to the semiconductor industry. This company was capitalized by private ...
www.chippac.com
Manufacturer of special cases used to attach semiconductors to printed circuit boards. Company also provides IC assembly and test services. Products and services are sold to the semiconductor industry. This company was capitalized by private ...
www.chippac.com
Chip Supply
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
www.chipsupply.com
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
www.chipsupply.com
D
DSP Architectures
Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
www.dsparchitectures.com
Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
www.dsparchitectures.com
Dynacraft
Manufacturer of lead frames. Also designs, manufactures and supplies microelectronic packaging systems.
www.dynacraft.com
Manufacturer of lead frames. Also designs, manufactures and supplies microelectronic packaging systems.
www.dynacraft.com
E
E-Mark
Supplier of interconnects and switches, including barrier strips, connectors and headers, data mates, dip switches, sockets and more.
www.e-markinc.com
Supplier of interconnects and switches, including barrier strips, connectors and headers, data mates, dip switches, sockets and more.
www.e-markinc.com
Enplas-Tesco
Manufacturer of IC test and burn-in sockets, ball grid arrays (BGA) and more.
www.enplas.com
Manufacturer of IC test and burn-in sockets, ball grid arrays (BGA) and more.
www.enplas.com
F
F & K Delvotec
Manufacturer of die and wire bonders for discrete devices, integrated circuits (ICs), hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
www.fkdelvotecusa.com
Manufacturer of die and wire bonders for discrete devices, integrated circuits (ICs), hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
www.fkdelvotecusa.com
Flip Chip Technologies LLC
Provider of wafer bumping services, reliability modeling, test vehicles, lead-free solder alloys, fluxes and assembly process implementation. Products and services are sold to the semiconductor industry.
www.flipchip.com
Provider of wafer bumping services, reliability modeling, test vehicles, lead-free solder alloys, fluxes and assembly process implementation. Products and services are sold to the semiconductor industry.
www.flipchip.com
Fujitsu Microelectronics Europe
European-based designer, manufacturer and marketer of microelectronic products, including SDRAM and SGRAM, memory modules, flash memory ICs and cards, networking devices, ASICs, multimedia ICs, hybrid/multi-chip modules, piezoelectric devices a...
www.fujitsu-fme.com
European-based designer, manufacturer and marketer of microelectronic products, including SDRAM and SGRAM, memory modules, flash memory ICs and cards, networking devices, ASICs, multimedia ICs, hybrid/multi-chip modules, piezoelectric devices a...
www.fujitsu-fme.com
K
Kulicke & Soffa (K&S)
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
www.kns.com
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
www.kns.com
Kyocera Corporation
Manufacturer of chip-scale packages for use as mobile phones, DVC, PC cards and various other applications.
www.kyocera.co.jp
Manufacturer of chip-scale packages for use as mobile phones, DVC, PC cards and various other applications.
www.kyocera.co.jp
M
Micro Circuit Engineering (MCE)
Supplier of ASICs (application-specific integrated circuits), hybrid circuits and multichip modules (MCMs) to the aerospace, telecom, industrial and related industries.
www.micro-circuit.com
Supplier of ASICs (application-specific integrated circuits), hybrid circuits and multichip modules (MCMs) to the aerospace, telecom, industrial and related industries.
www.micro-circuit.com
Micronsult
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
www.micronsult.dk
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
www.micronsult.dk
N
National Semiconductor
Manufacturer of BGA, micro SMD, laminate CSP and leadless lead-frame package (LLP) packages.
www.national.com
Manufacturer of BGA, micro SMD, laminate CSP and leadless lead-frame package (LLP) packages.
www.national.com
NGK Spark Plug Company
Manufacturer of ceramic products which includes packages, multichip modules and more for the semiconductor and related industries.
www.ngkntk.co.jp
Manufacturer of ceramic products which includes packages, multichip modules and more for the semiconductor and related industries.
www.ngkntk.co.jp
P
Palomar Technologies
Manufacturer of hybrid/multichip modules (MCMs) and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders and fully automated assembly lines.
www.palomartechnologies.com
Manufacturer of hybrid/multichip modules (MCMs) and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders and fully automated assembly lines.
www.palomartechnologies.com
Pantronix
Manufacturer of semiconductors. Produces multichip modules, hybrids, boards, smart cards, and complete builds.
www.pantronix.com
Manufacturer of semiconductors. Produces multichip modules, hybrids, boards, smart cards, and complete builds.
www.pantronix.com
Polymer Flip Chip
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
www.pfccorp.com
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
www.pfccorp.com
Groupe Arnaud Electronics
Supplier of materials such as indium phosphide (InP) and accessories to the electronics industry from ultrapure metals to chip-scale packaging.
www.promecome.com
Supplier of materials such as indium phosphide (InP) and accessories to the electronics industry from ultrapure metals to chip-scale packaging.
www.promecome.com
Pure Technologies
Manufacturer of low-alpha and ultralow-alpha lead and lead products ideal for flip chip and C-4 technology in the semiconductor industry.
www.puretechnologies.com
Manufacturer of low-alpha and ultralow-alpha lead and lead products ideal for flip chip and C-4 technology in the semiconductor industry.
www.puretechnologies.com
R
RD Automation
Manufacturer of fully automated and manual flip chip bonding systems.
www.rdautomation.com
Manufacturer of fully automated and manual flip chip bonding systems.
www.rdautomation.com
S
Sac-Tec Labs
Manufacturer of multichip modules (MCM), hybrids and surface-mount modules.
www.sactec.com
Manufacturer of multichip modules (MCM), hybrids and surface-mount modules.
www.sactec.com
Silitronics
Specialist in thick-film hybrid, multichip module-ceramic (MCM-C), microwave and surface mount technology (SMT) circuits.
www.silitronics.com
Specialist in thick-film hybrid, multichip module-ceramic (MCM-C), microwave and surface mount technology (SMT) circuits.
www.silitronics.com
S.M.T. Assembly
Specialist in surface mount, chip-on-board, through-hole and final casing assemblies for the original equipment manufacturers' market.
www.smt.com.hk
Specialist in surface mount, chip-on-board, through-hole and final casing assemblies for the original equipment manufacturers' market.
www.smt.com.hk
Substrate Technologies (STI)
Provider of laminate substrate requirements, including packaging solutions that include the ultra ball grid array (BGA).
www.sti-dallas.com
Provider of laminate substrate requirements, including packaging solutions that include the ultra ball grid array (BGA).
www.sti-dallas.com
T
Tessera, Inc.
Manufacturer of chip scale packaging and hybrid ICs. Products are sold to multiple industries. This company was capitalized by private investment and venture capital.
www.tessera.com
Manufacturer of chip scale packaging and hybrid ICs. Products are sold to multiple industries. This company was capitalized by private investment and venture capital.
www.tessera.com
U
Unitive Electronics
Provider of semiconductor processing services that include flip chip wafer bumping for BGA and CSP applications, multiple redistribution technologies and repassivation.
www.unitive.com
Provider of semiconductor processing services that include flip chip wafer bumping for BGA and CSP applications, multiple redistribution technologies and repassivation.
www.unitive.com
Company Profiles – Click here to view
|
|
|
MIcroelectronics Assembly
World-class Wire Bond & Flip Chip Class 100 facilities; Design to Mfg
www.aspentechnologies.com
World-class Wire Bond & Flip Chip Class 100 facilities; Design to Mfg
www.aspentechnologies.com
IC Prototype Packaging
Plastic packages, IC Assembly, Wafer preparation, Custom services
www.icproto.com
Plastic packages, IC Assembly, Wafer preparation, Custom services
www.icproto.com
3D Packaging Solutions
Unique dry film photoresist system for TSV formation and protection
wlpsolutions.dupont.com
Unique dry film photoresist system for TSV formation and protection
wlpsolutions.dupont.com
