Related Business Topics
I
IC Interconnect
Provider of contract wafer bumping services to the electronics industry.
www.icinterconnect.com
Provider of contract wafer bumping services to the electronics industry.
www.icinterconnect.com
IMI (International Micro Industries)
Supplier of bare die advanced semiconductor assembly, test machines, flip chip wafer bumping and flex tape carrier formatting contract services.
www.imi-corp.com
Supplier of bare die advanced semiconductor assembly, test machines, flip chip wafer bumping and flex tape carrier formatting contract services.
www.imi-corp.com
M
Micronsult
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
www.micronsult.dk
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
www.micronsult.dk
P
PacTech
Provider of subcontracting bumping and packaging services for chip-size packages based on electroless metallization.
www.pactech.de
Provider of subcontracting bumping and packaging services for chip-size packages based on electroless metallization.
www.pactech.de
Polymer Flip Chip
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
www.pfccorp.com
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
www.pfccorp.com
