SpeedFam - SFAM- Profile

Speedfam-Ipec Incorporated. The Group's principal activity is to manufacture and market chemical mechanical planarization systems. The Group operates in three business segments. The CMP Group develops chemical mechanical planarization systems for use in advanced semiconductor devices. The Surface Technology Group sells precision surface processing equipment used in silicon wafer products. The Industrial Applications Group sells precision surface processing equipment for general industrial applications. Manufacturing facilities are at Des Paines, Illinois and Chandler, Arizona. Customers consist of manufacturers of semiconductor devices and silicon wafers. The Group has sales offices in the United Kingdom, Germany, Taiwan, Korea, Singapore, Malaysia and Japan. In 2002, it has entered into an agreement to merge with Novellus Systems, Inc. Chemical Mechanical Planarization Group accounted for 74% of fiscal 2002 revenues; Surface Technology Group, 14% and Industrial Applications Group, 12%. Chemical Mechanical Planarization gp acctd for 74% of fis 2002 revs; Surface Technology gp, 14% & Indus Applications gp, 12%