Manufacturers and suppliers of integrated circuit packages.
Purchasing Resources for IC Packages
Wirebond and Flip Chip Packaging of ICs & MEMS. Design to Mfg.
QFN, SiP, Custom Packaging Silicon Valley's Packaging Foundry
Manufacturer Of BGA/PGA/DIP/SIP And PLCC Sockets. Free Samples Online!
High Density 3D Memory Packaging multichip, stacking, flip chip
Download IC Packages White Papers
IC Packages
Connect with IC packaging specialists for custom, reliable IC packagesBy Apryl Beverly Simply defined, IC packages are a collection of materials used to protect and interconnect an integrated circuit to the operating system. Today, there is a variety of integrated circuit packages available to customize your integrated circuits. Examples of IC packaging types include tinning, tape and reel packaging, lead forming, baking, lead straightening and programming.
Integrated circuit packages are classified based on the amount of pins in the chip. Today IC chip packaging has become popular, because this method is useful in applications with a low number of pins. Three dimensional (3D) IC packaging is the most recent method used in a broad range of applications: including digital and mixed signal electronics, wireless communication products, sensors and a variety of other devices.
Consider the following tips when choosing integrated circuit package types for your device:
1. Determine which integrated circuit package you need for your electronic device.
2. Find an IC package engineer to help you choose the most reliable IC packaging material.
3. Connect with IC packaging services firms for advice on a full range of IC packaging types.
Evaluate various IC packaging options for your specific electronic device
Dual in-line integrated circuit packaging is the earliest and most commonly used IC package type, because it is manageable. Alternatively, with new technology there are other IC package assembly methods available that are less expensive and even more manageable.
Try:
DuPont offers 3D IC packaging solutions and allows you to ask questions about a specific IC package type by completing an online form. Maxtek offers semiconductor-packaging services and makes sure you receive uniquely designed IC packages that are manageable and testable.
Seek IC packaging materials advice from an experienced IC package engineer
While silicon and ceramic are standard IC package materials, there are a range of materials that are more durable and flexible. Wafer and substrate bumping pastes and IC chip packaging are a few examples of more durable and flexible IC package types.
Try:
IC Chip Packaging offers a range of IC packaging services including IC repackaging. With Quik-Pak, customers can provide their own IC packages for processing or the company can consult you on your IC package options and obtain the one that best fits your goals.
Rely on IC packaging services firms as one-stop shops
Getting a new prototype to production can be a difficult process if you are unsure of the proper steps to take. IC package assembly, while an extremely important step, is only one of necessary phases to move your device from conception to production.
Try:
Aspen Technologies offers the full range of services from new product evaluation to design and IC packaging to production. Wipro offers a full line of advisory, design, IC packaging and manufacturing services to help you turn your idea into an actual product.
- Making a huge push in Asia and Europe, green integrated circuit packaging is quickly becoming a global initiative in IC packaging. While green IC packaging materials are generally more expensive and less available, you may want to consider environmentally friendly options.
Wirebond and Flip Chip Packaging of ICs & MEMS. Design to Mfg.
QFN, SiP, Custom Packaging Silicon Valley's Packaging Foundry
Manufacturer Of BGA/PGA/DIP/SIP And PLCC Sockets. Free Samples Online!
High Density 3D Memory Packaging multichip, stacking, flip chip
Interconnect solutions provider to original equipment manufacturers, including ball grid array (BGA) applications.
http://www.adapter-tech.com/toc.htm
Advanced Interconnect Technology
Provider of consultancy services for flip chip on glass (FCOG), flip chip on board (FCOB) and flip chip on flex (FCOF) packaging technologies.
Advanced Packaging Technology of America
Manufacturer of hybrid circuit boards, ceramic multi-chip modules, thick-film substrates and cerlids. The cerlids are alumina ceramics used to seal semiconductor packages. Also a provider of surface mount design, testing and assembly services. Products
AIT (Advanced Interconnect Technolgies)
Provider of packaging portfolio and valuable services. Designs ball grid array (BGA) and leaded packages.
Manufacturer of advanced mixed-signal integrated circuits, including hall-effect sensors, motor driver ICs, and power interface and management ICs.
Manufacturer of chip-scale packages (CSPs) needed to address high-density requirements.
Manufacturer of printed circuit board rework machines for SMT and BGA components and gold plating and multilayer desolder systems.
Manufacturer of IC sockets, printed circuit cards, packaging products, intelligent connectors, BGA (ball grid array) and LGA (land grid array) sockets, adapters and a variety of jumper and cable assemblies.
Manufacturer of integrated circuit (IC) lead-frame applications equipment and material, chip on board (COB) and discrete device application equipment.
Austin American Technology Corp.
Manufacturer of ball grid array rework systems; automatic batch cleaning systems which are used for PCBs, screens and stencils; and surface mount repair/rework systems. Products are sold to the electronics and graphics industries. This company was capit
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
Manufacturer of special cases used to attach semiconductors to printed circuit boards. Company also provides IC assembly and test services. Products and services are sold to the semiconductor industry. This company was capitalized by private investment
Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
http://www.dsparchitectures.com/
Manufacturer of lead frames. Also designs, manufactures and supplies microelectronic packaging systems.
Supplier of interconnects and switches, including barrier strips, connectors and headers, data mates, dip switches, sockets and more.
Manufacturer of BGA adapters, QFP adapters and test leads. Provider of custom manufacturing. Products and services are sold to the embedded systems industry. This company was capitalized by private investment.
Manufacturer of IC test and burn-in sockets, ball grid arrays (BGA) and more.
Manufacturer of die and wire bonders for discrete devices, integrated circuits (ICs), hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
Provider of wafer bumping services, reliability modeling, test vehicles, lead-free solder alloys, fluxes and assembly process implementation. Products and services are sold to the semiconductor industry.
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
Manufacturer of chip-scale packages for use as mobile phones, DVC, PC cards and various other applications.
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
Manufacturer of BGA, micro SMD, laminate CSP and leadless lead-frame package (LLP) packages.
http://www.national.com/packaging/other.html#microSMD
Manufacturer of ceramic products which includes packages, multichip modules and more for the semiconductor and related industries.
Manufacturer of hybrid/multichip modules (MCMs) and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders and fully automated assembly lines.
http://www.palomartechnologies.com/
Manufacturer of semiconductors. Produces multichip modules, hybrids, boards, smart cards, and complete builds.
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
Manufacturer of low-alpha and ultralow-alpha lead and lead products ideal for flip chip and C-4 technology in the semiconductor industry.
http://www.puretechnologies.com/
Manufacturer of fully automated and manual flip chip bonding systems.
Specialist in surface mount, chip-on-board, through-hole and final casing assemblies for the original equipment manufacturers' market.
Manufacturer of multichip modules (MCM), hybrids and surface-mount modules.
Specialist in thick-film hybrid, multichip module-ceramic (MCM-C), microwave and surface mount technology (SMT) circuits.
Manufacturer of chip scale packaging and hybrid ICs. Products are sold to multiple industries. This company was capitalized by private investment and venture capital.
Tips & Advice to help you make your decision on IC Packages
IC packages, also called integrated circuit packages, are widely used in the manufacturing and industrial industries to interconnect circuits that are used in many electronic and communication devices. If you are in the business of manufacturing cell phones, video games, microwaves or any item that uses electricity, you'll need to order IC packages from reputable manufacturers. Business owners who are not familiar with IC packages usually get help from engineers. These engineers can help you choose the circuit package that works best with your product, and they'll be able to test the functionality of your product once the IC package is installed..
If your business relies on these ... more
IC packages, also called integrated circuit packages, are widely used in the manufacturing and industrial industries to interconnect circuits that are used in many electronic and communication devices. If you are in the business of manufacturing cell phones, video games, microwaves or any item that uses electricity, you'll need to order IC packages from reputable manufacturers. Business owners who are not familiar with IC packages usually get help from engineers. These engineers can help you choose the circuit package that works best with your product, and they'll be able to test the functionality of your product once the IC package is installed..
If your business relies on these packages for product creation and development, it is a good idea to contract with two or three companies that sell the type and brand you need. Maxtek is an IC packaging company that specializes in semiconductor packages, which are easy to test before installation. IC Chip Packaging is a Texas-based company that offers packaging services as well. They also offer repacking services, which allows manufacturers to use one circuit package for multiple devices. If you sell a wide range of electronic devices, contact companies that carry large varieties of circuit packages. You may also choose to have integrated circuit packages customer-made for your product. Learn more about IC packages by clicking the links on this Business.com page.