Purchasing resources for IC Packages

Simply defined, IC packages are a collection of materials used to protect and interconnect an integrated circuit to the operating system. Today, there is a variety of integrated circuit packages available to customize your integrated circuits. Examples of IC packaging types include tinning, tape and reel packaging, lead forming, baking, lead straightening and programming.

Integrated circuit packages are classified based on the amount of pins in the chip. Today IC chip packaging has become popular, because this method is useful in applications with a low number of pins. Three dimensional (3D) IC packaging is the most recent method used in a broad range of applications: including digital and mixed signal electronics, wireless communication products, sensors and a variety of other devices.

Consider the following tips when choosing integrated circuit package types for your device:

1. Determine which integrated circuit package you need for your electronic device.

2. Find an IC package engineer to help you choose the most reliable IC packaging material.

3. Connect with IC packaging services firms for advice on a full range of IC packaging types.

Evaluate various IC packaging options for your specific electronic device

Dual in-line integrated circuit packaging is the earliest and most commonly used IC package type, because it is manageable. Alternatively, with new technology there are other IC package assembly methods available that are less expensive and even more manageable.

Seek IC packaging materials advice from an experienced IC package engineer

While silicon and ceramic are standard IC package materials, there are a range of materials that are more durable and flexible. Wafer and substrate bumping pastes and IC chip packaging are a few examples of more durable and flexible IC package types.

Rely on IC packaging services firms as one-stop shops

Getting a new prototype to production can be a difficult process if you are unsure of the proper steps to take. IC package assembly, while an extremely important step, is only one of necessary phases to move your device from conception to production.

• Making a huge push in Asia and Europe, green integrated circuit packaging is quickly becoming a global initiative in IC packaging. While green IC packaging materials are generally more expensive and less available, you may want to consider environmentally friendly options.