IC Packaging/Assembly Contract Manufacturing

IC packaging is one of the most important electronic system design elements
By Apryl Beverly The Integrated Circuit (IC) packaging/assembly contract manufacturing has grown to meet business owners' demand for better performance. Besides testing, IC packaging is the final phase of semiconductor manufacturing - creation of the chip. In this step, the IC packaging house mounts and interconnects semiconductor devices.

IC packaging/assembly contract manufacturing is a process used to protect the die from physical damage and assemble a more manageable component. IC packaging is also ideal for connecting multiple ICs. Consider taking the following steps when purchasing IC packaging:

1. Be sure to choose an IC package best suited for your device.

2. Evaluate services offered by semiconductor houses and select one that offers a broad range of standard packaging services as well as custom packaging assembly.

3. Consult with IC packaging specialists who are knowledgeable about new and cutting-edge IC assembly methods and equipment.

IIdentify IC packaging tailored to the material and design of your device

While there are various types of IC packages, they can be broadly categorized as lead-frame packaging and substrate packaging. Lead-frame packaging is mostly used for wire-bond interconnected die. Substrate packaging uses organic-laminate or ceramic materials. Consider the packaging cost, manageability, effectiveness and how your packaging choice affects the environment.
Try:  CORWIL Technology Corporation offers a broad range of packaging assembly services designed to meet the specific needs of various businesses. Aspen Technologies offers wire-bond and ceramic IC packaging.

Consult with a semiconductor assembly house for specialized IC packaging srvices

IC packaging/assembly contract manufacturing generally involves packaging ICs in opaque ceramic or plastic insulation. However, on rare occasions proximity communication and partially or completely transparent packaging is used. Proximity communication involves a process in which raw die is attached directly to a printed circuit board. This process allows the chips to communicate at higher speeds while using less energy.
Try:  PTI Seminars offers several onsite semiconductor-related courses including the "Introduction to Integrated Circuit Packaging and Assembly." This course can be useful and informative for device engineers, tool vendors, procurement, sales and marketing staff and other business owners and employees in the electronic manufacturing industry. Xilinx also offers courses designed to help attendees understand the IC packaging process so that they can describe the correct IC package to meet their design objectives.

Acquire IC packaging services online

Because package types change constantly and chip design has become so complex in recent years, it may be wise to outsource your IC packaging needs. Be sure to choose an IC packaging services vendor that stays current on expanding technology and uses highly automated flexible equipment. While speed is important, quality is even more so important when choosing a vendor for contract assembly.
Try:  Quik-Pak offers contract assembly and IC packaging services. Advotech offers a broad range of IC assembly services.

• Understand that IC packaging is merely one piece of a lengthy process. The entire semiconductor manufacturing process from start to packaged chips takes approximately six to eight weeks.