Resources for IC Packaging/Assembly Contract Manufacturing

The Integrated Circuit (IC) packaging/assembly contract manufacturing has grown to meet business owners' demand for better performance. Besides testing, IC packaging is the final phase of semiconductor manufacturing - creation of the chip. In this step, the IC packaging house mounts and interconnects semiconductor devices.

IC packaging/assembly contract manufacturing is a process used to protect the die from physical damage and assemble a more manageable component. IC packaging is also ideal for connecting multiple ICs. Consider taking the following steps when purchasing IC packaging:

1. Be sure to choose an IC package best suited for your device.

2. Evaluate services offered by semiconductor houses and select one that offers a broad range of standard packaging services as well as custom packaging assembly.

3. Consult with IC packaging specialists who are knowledgeable about new and cutting-edge IC assembly methods and equipment.

IIdentify IC packaging tailored to the material and design of your device

While there are various types of IC packages, they can be broadly categorized as lead-frame packaging and substrate packaging. Lead-frame packaging is mostly used for wire-bond interconnected die. Substrate packaging uses organic-laminate or ceramic materials. Consider the packaging cost, manageability, effectiveness and how your packaging choice affects the environment.

Consult with a semiconductor assembly house for specialized IC packaging srvices

IC packaging/assembly contract manufacturing generally involves packaging ICs in opaque ceramic or plastic insulation. However, on rare occasions proximity communication and partially or completely transparent packaging is used. Proximity communication involves a process in which raw die is attached directly to a printed circuit board. This process allows the chips to communicate at higher speeds while using less energy.

Acquire IC packaging services online

Because package types change constantly and chip design has become so complex in recent years, it may be wise to outsource your IC packaging needs. Be sure to choose an IC packaging services vendor that stays current on expanding technology and uses highly automated flexible equipment. While speed is important, quality is even more so important when choosing a vendor for contract assembly.

• Understand that IC packaging is merely one piece of a lengthy process. The entire semiconductor manufacturing process from start to packaged chips takes approximately six to eight weeks.