Purchasing resources for IC Packaging/Assembly Contract Manufacturing


Providers of assembly services for integrated circuit (IC) packaging.

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QTS Packaging Solutions

QTS is a leader in outsourcing solutions for medical device package design, assembly, validation, passivation and sterilization.

http://www.qtspackage.com
All-in-One Printer

Directory of all-in-one printer office machines for businesses that need to fax, copy, print, and scan documents with an MFP.

www.business.com/technology/all-in-one-printer/
Online Document Storage

Providers of online document storage services. Research online document storage companies offering electronic document storage. Identify online record storage services that fit your business needs.

www.business.com/technology/online-document-storage/
Software as a Service (SAAS)

Business directory to Software as a Service (SAAS).

www.business.com/technology/software-as-a-service/
Office All-in-Ones

Source: /technology/all-in-one-printer/

Every business, no matter the size, needs the basics of an office all-in-one: a fax machine, copier, printer and scanner. Why spend thousands to buy stand-alones separately when you can get the complete package in one device? Office all-in-ones, also known as multi-function machines, are great for home office use and small businesses alike. Read More »

Cloud Computing

Source: /technology/cloud-computing/

If you're considering cloud computing for your business, you'll be in company with many firms that are using this technology. Cloud computing, which provides service as a software, enables users to get into applications that are in the server cloud. Read More »

IC Packaging/Assembly Contract Manufacturing


The Integrated Circuit (IC) packaging/assembly contract manufacturing has grown to meet business owners' demand for better performance. Besides testing, IC packaging is the final phase of semiconductor manufacturing - creation of the chip. In this step, the IC packaging house mounts and interconnects semiconductor devices.

IC packaging/assembly contract manufacturing is a process used to protect the die from physical damage and assemble a more manageable component. IC packaging is also ideal for connecting multiple ICs. Consider taking the following steps when purchasing IC packaging:

1. Be sure to choose an IC package best suited for your device.

2. Evaluate services offered by semiconductor houses and select one that offers a broad range of standard packaging services as well as custom packaging assembly.

3. Consult with IC packaging specialists who are knowledgeable about new and cutting-edge IC assembly methods and equipment.

IIdentify IC packaging tailored to the material and design of your device

While there are various types of IC packages, they can be broadly categorized as lead-frame packaging and substrate packaging. Lead-frame packaging is mostly used for wire-bond interconnected die. Substrate packaging uses organic-laminate or ceramic materials. Consider the packaging cost, manageability, effectiveness and how your packaging choice affects the environment.

Consult with a semiconductor assembly house for specialized IC packaging srvices

IC packaging/assembly contract manufacturing generally involves packaging ICs in opaque ceramic or plastic insulation. However, on rare occasions proximity communication and partially or completely transparent packaging is used. Proximity communication involves a process in which raw die is attached directly to a printed circuit board. This process allows the chips to communicate at higher speeds while using less energy.

Acquire IC packaging services online

Because package types change constantly and chip design has become so complex in recent years, it may be wise to outsource your IC packaging needs. Be sure to choose an IC packaging services vendor that stays current on expanding technology and uses highly automated flexible equipment. While speed is important, quality is even more so important when choosing a vendor for contract assembly.

  • Understand that IC packaging is merely one piece of a lengthy process. The entire semiconductor manufacturing process from start to packaged chips takes approximately six to eight weeks.